Backed by years of industry experience, DK Enterprise is engaged in offering a premium quality range of FR4 Copper Clad Laminate Sheet. We are the leading organization for providing an extensive range of Flexible Fr4 Copper Clad Laminates Sheet. With the support of vast infrastructure, we are involved in manufacturing and supplying high performing FR4 Copper Clad Laminates.
FR4 Copper Clad Laminate is a sort of copper foil secured laminated board shaped through warmth squeezing after the electric industry antacid free glass fiber dips into thermoset epoxy resins and is secured with copper foil at one side or both sides. Typically used in PCB with printed circuit on one or both sides of computers, home electric appliances and different lines. Each vacuum fixed bundle comprises of five bits of copper clad laminates in either 1 ounce or .5 ounce double sided or 1 ounce single sided copper. With the aid of our technologically advanced production unit, we are able to offer FR4 Copper Clad Laminate at economical prices.
This PCB Laminate is fire resistant and is included of nonstop woven glass cloth restored with epoxy resin. The substrate is assigned FR4, the fire resistant form of G-10 material. We offer it in four unique assortments. 0.1-3.2 mm Thickness with 1/1 Copper, .059” (1.50mm) Thickness with 1/1, .5/.5 and 1/0 Copper.
We stand behind our products; a representative is available at any time via email or phone to answer any inquiries or concerns you may have.
Model | FR4 |
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MOQ | 1 Piece |
Place of Origin | China |
Thickness | 0.1-3.2 mm |
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Copper thickness | 12,15,18,25,30,35,50,70 μm, based on customers’ |
General Size (inch) | 37*49,41*49,43*49,based on customers’ |
Item | Unit | Test conditions | Spec | Typical Value |
TG | ℃ | DSC | 135±5 | 135.5 |
1oz Peel Strength | N/mm | 288℃,10S | ≧1.40 | 1.76 |
Thermal Stress | S | 288℃,Floating Solder 288℃, Solder dip | >10 | 60s No delamination |
Flexural Strength | N/mm2 | LW | ≧415 | 575 |
CW | ≧345 | 475 | ||
Flammability | E24/125 | UL94V-0 | V-0 | |
Surface Resistivity | MΩ | After Moisture | ≧1.0*104 | 5.25*107 |
Volume Resistivity | MΩ·CM | After Moisture | ≧1.0*106 | 5.10*108 |
Dielectric Constant | 1MHZ C24/23/50 | ≦5.4 | 4.6 | |
Loss Tangent | 1MHZ C24/23/50 | ≦0.035 | 0.015 | |
Arc Resistance | S | D48/50+D0.5/23 | ≧60 | 120 |
Dielectric Breakdown | KV | D48/50+D0.5/23 | ≧40 | 55 |
Moisture Absorption | % | D24/23 | ≦0.5 | 0.15 |
CTI | V | IEC-6012 | ≧550 | 600 |